Molecular dynamics simulations of void coalescence in monocrystalline copper under loading and unloading
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4947051
Reference55 articles.
1. Computational models for ductile and brittle fracture
2. Ductile fracture
3. Review on the fracture processes in nanocrystalline materials
4. Thermal decomposition of ZrO2/SiO2 bilayer on Si(001) caused by void nucleation and its lateral growth
5. Shock-induced spall in solid and liquid Cu at extreme strain rates
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Atomistic analysis of the mechanisms underlying irradiation-hardening in Fe–Ni–Cr alloys;International Journal of Plasticity;2024-11
2. Molecular Dynamics Simulations of the Thermal Evolution of Voids in Cu Bulk and Grain Boundaries;The Minerals, Metals & Materials Series;2023
3. The Effect of Compression on the Void Coalescence under Strong Dynamic Loading;Advances in Materials Science and Engineering;2022-02-28
4. Atomic Simulation of Crystallographic Orientation Effect on Void Shrinkage and Collapse in Single-Crystal Copper under Shock Compression;Journal of Materials Engineering and Performance;2021-11-29
5. Investigation on void growth and coalescence in single crystal copper under high-strain-rate tensile loading by atomistic simulation;Mechanics of Materials;2020-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3