Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model
Author:
Affiliation:
1. imec, Kapeldreef 75, B-3001, Leuven, Belgium
2. Faculty of Engineering Sciences, KU Leuven, B-3001, Leuven, Belgium
3. Institute for Microelectronics, TU Wien, Gußhausstraße 27-29/E360, 1040, Wien, Austria
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
https://aip.scitation.org/doi/pdf/10.1063/5.0039953
Reference30 articles.
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3. S. Choi et al. “Effect of metal line width on electromigration of BEOL Cu interconnects,” in IEEE International Reliability Physics Symposium (IRPS) (IEEE, Burlingame, CA, 2018), pp. 4F.4-1–4F.4-6.
4. K. Croes et al. “Reliability mechanisms and lifetime extrapolation methods for scaled interconnect technologies,” in IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM, IEEE, 2015), pp. 295–298.
5. Study of void formation kinetics in Cu interconnects using local sense structures
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