Author:
Motalab Mohammad Abdul,Ahmed Md. Tusher,Bappy Md. Omarsany
Reference13 articles.
1. K. N. Tu, (2007) “Fundamentals of Electromigration” in Solder Joint Technology, edited by R. Hull, R.M. Osgood, Jr. J. Parisi, H. Warlimont (Springer, New York, 2007),.pp. 211–243.
2. J. Zhang, Z. Hai, S. Thirugnanasambandam, J. L. Evans, M. J. Bozack, Y. Zhang, and J. C. Suhling, “Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages,” in IEEE transactions on components, packaging and manufacturing technology-2013, IEEE Conference Proceedings 3(8), pp. 1348–1357.
3. H. Ma, J. C. Suhling, P. Lall, and M. J. Bozack, “Reliability of the aging lead free solder joint,” in Electronic Components and Technology Conference-2006, IEEE Conference Proceedings 56, pp. 849–864.
4. The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures
5. Y. Chen, Z. Sheng, B. Jing and J. Hu, “Failure Mode Analysis of Board-Level Solder Joint under Random Vibration Load” in International Conference on Electronics Technology-2018, IEEE Conference Proceedings, pp. 170–174.