Roughness evolution of Cu6Sn5 intermetallic during soldering
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.371460
Reference17 articles.
1. Interdiffusion and reaction in bimetallic Cu-Sn thin films
2. Reaction-Diffusion in the Cu–Sn System
3. Volume-expansion-induced lattice instability and solid-state amorphization
4. Three‐dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu
5. The growth of Cu-Sn intermetallics at a pretinned copper-solder interface
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