Thermal management of a 3D packaging structure for superconducting quantum annealing machines-Reference-Cited by-同舟云学术

Thermal management of a 3D packaging structure for superconducting quantum annealing machines

Published:2021-04-26 Issue:17 Volume:118 Page:174004
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Feng Wei¹^ORCID,Kikuchi Katsuya¹^ORCID,Hidaka Mutsuo¹^ORCID,Yamamori Hirotake¹^ORCID,Araga Yuuki¹^ORCID,Makise Kazumasa²^ORCID,Kawabata Shiro²^ORCID

Affiliation:

1. Device Technology Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki 305-8560, Japan

2. Research Center for Emerging Computing Technology (RCECT), National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki 305-8568, Japan

Funder

New Energy and Industrial Technology Development Organization

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0039822

Reference34 articles.

1. Polynomial-Time Algorithms for Prime Factorization and Discrete Logarithms on a Quantum Computer

2. Quantum Mechanical Computers

3. Universal Quantum Simulators

4. Quantum annealing in the transverse Ising model

5. Experimental investigation of an eight-qubit unit cell in a superconducting optimization processor

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