Study of Ni as a barrier metal in AuSn soldering application for laser chip/submount assembly
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.352279
Reference7 articles.
1. Kinetics of intermetallic compound growth between nickel, electroless, Ni-P, electroless Ni-B and tin at 453 to 493 K
2. Barrier Layers Against Diffusion
3. The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead Alloys
4. Thermal stability of various ball-limited-metal systems under solder bumps
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