Co-optimizing grating couplers for hybrid integration of InP and SOI photonic platforms
Author:
Affiliation:
1. Photonic Packaging Group, Tyndall National Institute, T12R5CP Cork, Ireland
2. Department of Physics, University of Pavia, 27100 Pavia, Italy
Funder
Science Foundation Ireland
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5046164
Reference15 articles.
1. Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
2. A Grating-Coupler-Enabled CMOS Photonics Platform
3. High-efficiency fiber-to-chip grating couplers realized using an advanced CMOS-compatible Silicon-On-Insulator platform
4. Wideband subwavelength gratings for coupling between silicon-on-insulator waveguides and optical fibers
5. High-directionality fiber-chip grating coupler with interleaved trenches and subwavelength index-matching structure
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