Probe-based microscale measurement setup for the thermal diffusivity of soft materials
Author:
Affiliation:
1. National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Umezono, Tsukuba 305-8563, Japan
2. Tokyo Institute of Technology, 2-12-1, Ookayama, Meguro-ku, Tokyo 152-8550, Japan
Abstract
Funder
Japan Society for the Promotion of Science London
Core Research for Evolutional Science and Technology
Publisher
AIP Publishing
Subject
Instrumentation
Link
https://aip.scitation.org/doi/pdf/10.1063/5.0084891
Reference50 articles.
1. Residual stress and thermal expansion of spun-on polyimide films
2. Thermal diffusivity of aromatic polyimide thin films by temperature wave analysis
3. Application of the three omega method for the thermal conductivity measurement of polyaniline
4. Thermal conductivity of amorphous solids above the plateau
5. Thermal diffusivity measurement of polymer films by the temperature wave method using joule-heating
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