High thermal conductivity and ultrahigh thermal boundary conductance of homoepitaxial AlN thin films-Reference-Cited by-同舟云学术

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High thermal conductivity and ultrahigh thermal boundary conductance of homoepitaxial AlN thin films

Published:2022-01-01 Issue:1 Volume:10 Page:011115
ISSN:2166-532X
Container-title:APL Materials
language:en
Short-container-title:APL Materials

Author:

Alvarez-Escalante Gustavo¹^ORCID,Page Ryan²^ORCID,Hu Renjiu¹^ORCID,Xing Huili Grace²³^ORCID,Jena Debdeep²³^ORCID,Tian Zhiting¹^ORCID

Affiliation:

1. Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, New York 14853, USA

2. Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853, USA

3. School of Electrical and Computer Engineering, Cornell University, Ithaca, New York 14853, USA

Funder

National Science Foundation

National GEM Consortium

NSF

Publisher

AIP Publishing

Subject

General Engineering,General Materials Science

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0078155

Reference37 articles.

1. Thermal conductivity of crystalline AlN and the influence of atomic-scale defects

2. Molecular beam homoepitaxy on bulk AlN enabled by aluminum-assisted surface cleaning

3. Substrate-dependent thermal conductivity of aluminum nitride thin-films processed at low temperature

4. Ain single crystals

5. The intrinsic thermal conductivity of AIN

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4. Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces;ACS Applied Electronic Materials;2024-04-11

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