Impedance response and modeling of composites containing aligned semiconductor whiskers: Effects of dc-bias partitioning and percolated-cluster length, topology, and filler interfaces-Reference-Cited by-同舟云学术

Impedance response and modeling of composites containing aligned semiconductor whiskers: Effects of dc-bias partitioning and percolated-cluster length, topology, and filler interfaces

Published:2012-06-15 Issue:12 Volume:111 Page:124913
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Bertram Brian D.,Gerhardt Rosario A.,Schultz John W.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4729119

Reference32 articles.

1. Electrical Conductivity of Composite Materials Based on Fine-Particle Silicon near the Metal–Insulator Transition

2. NonlinearI-Vcharacteristics near the percolation threshold

3. Insulator conductor transition in low-density polyethylene–graphite composites

4. Contemporary Problems in Statistical Physics

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