Author:
Felmet Kimberly,Loo Yueh-Lin,Sun Yangming
Subject
Physics and Astronomy (miscellaneous)
Reference28 articles.
1. K. Wijekoon, S. Tsai, D. Bennet, and F. Redeker, Chemical Mechanical Planarization in IC Device Manufacturing III, edited by R. L. Opila, I. Ali, Y. A. Arimoto, Y. Homma, C. Redisema-Simpson, and K. B. Sundaram (The Electrochemical Society, Pennington, NJ, 1999), pp. 158–162.
2. Chemical-mechanical polishing of copper for interconnect formation
3. Chemical mechanical polishing of copper for multilevel metallization
4. Chemical processes in the chemical mechanical polishing of copper
5. Current Trends in Patterning with Copper
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