Limiting role of dislocations in high-current AlGaN/GaN hot electron transistors

Author:

Daulton J. W.12ORCID,Molnar R. J.1ORCID,Brinkerhoff J. A.1ORCID,Weir T. J.1,Hollis M. A.1ORCID,Zaslavsky A.2ORCID

Affiliation:

1. MIT Lincoln Laboratory 1 , Lexington, Massachusetts 02142, USA

2. School of Engineering, Brown University 2 , Providence, Rhode Island 02912, USA

Abstract

III-nitride-based hot electron transistors (HETs) hold significant promise as high-speed, high-power devices. In our previous work, we demonstrated high current density and common-emitter gain at room temperature. Here, we measure multiple devices at cryogenic temperatures, extending the Gummel characteristics past the onset of intervalley scattering at 77 K. We demonstrate a Gummel current gain of 4.7 at a collector current density of 2.6 MA/cm2 at 77 K as well as a peak current density exceeding 3 MA/cm2. From these data, we determine that dislocation-associated inhomogeneities play a limiting role in AlGaN/GaN HETs, controlling the current gain, density, knee voltage, and base-collector leakage. A comparison of two nominally identical devices suggests that even a modest reduction in dislocation density would result in a substantial improvement in HET performance.

Funder

Office of the Under Secretary of Defense for Research and Engineering

Publisher

AIP Publishing

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