A model heterostructure with engineered Berry curvature

Author:

Schreiber Nathaniel J.1ORCID,Miao Ludi2ORCID,Goodge Berit H.3ORCID,Kourkoutis Lena F.34ORCID,Shen Kyle M.24ORCID,Schlom Darrell G.145ORCID

Affiliation:

1. Department of Materials Science and Engineering, Cornell University 1 , Ithaca, New York 14853, USA

2. Department of Physics, Laboratory of Atomic and Solid State Physics, Cornell University 2 , Ithaca, New York 14853, USA

3. School of Applied and Engineering Physics, Cornell University 3 , Ithaca, New York 14853, USA

4. Kavli Institute at Cornell for Nanoscale Science 4 , Ithaca, New York 14853, USA

5. Leibniz-Institut für Kristallzüchtung 5 , Max-Born-Str. 2, 12489 Berlin, Germany

Abstract

Molecular-beam epitaxy enables ultrathin functional materials to be combined in heterostructures to create emergent phenomena at the interface. Magnetic skyrmions are an example of an exciting phase found in such heterostructures. SrRuO3 and SrRuO3-based heterostructures have been at the center of the debate on whether a hump-like feature appearing in Hall resistivities is sufficient evidence to prove the presence of skyrmions in a material. To address the ambiguity, we synthesize a model heterostructure with engineered Berry curvature that combines, in parallel, a positive anomalous Hall effect (AHE) channel (a Sr0.6Ca0.4RuO3 layer) with a negative AHE channel (a SrRuO3 layer). We demonstrate that the two opposite AHE channels can be combined to artificially reproduce a “hump-like” feature, which closely resembles the hump-like feature typically attributed to the topological Hall effect and the presence of chiral spin textures, such as skyrmions. We compare our heterostructure with a parallel resistor model, where the inputs are the AHE data from individual Sr0.6Ca0.4RuO3 and SrRuO3 films. To check for the presence of skyrmions, we measure the current dependence, angle dependence, and minor loop dependence of Rhump in the heterostructure. Despite the clear hump, no evidence of skyrmions is found.

Funder

National Science Foundation

Gordon and Betty Moore Foundation

Publisher

AIP Publishing

Subject

General Engineering,General Materials Science

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