Process Monitoring And Surface Characterization By XPS In A Semiconductor Fabrication Line-Reference-Cited by-同舟云学术

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Process Monitoring And Surface Characterization By XPS In A Semiconductor Fabrication Line

Published:2007 Issue: Volume: Page:
ISSN:0094-243X
Container-title:AIP Conference Proceedings
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Author:

Cabuil N.,Le Gouil A.,Dickson B.,Lagha A.,Aminpur M.,Chaton C.,Royer J.-C.,Doclot O.,Seiler David G.,Diebold Alain C.,McDonald Robert,Garner C. Michael,Herr Dan,Khosla Rajinder P.,Secula Erik M.

Publisher

AIP

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Establishing a Link Between Carbon Concentration and Contact Angle on HMDS Surfaces;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01

2. X-ray photoelectron spectroscopy study of oxide semiconductors;Defect-Induced Magnetism in Oxide Semiconductors;2023

3. Angle-resolved photoemission studies of quantum materials;Reviews of Modern Physics;2021-05-26

4. High-K metal gate stacks with ultra-thin interfacial layers formed by low temperature microwave-based plasma oxidation;Microelectronic Engineering;2017-06

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