Thermal Expansion and Some Properties of CoSb[sub 3], RhSb[sub 3] and IrSb[sub 3]-Reference-Cited by-同舟云学术

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Thermal Expansion and Some Properties of CoSb[sub 3], RhSb[sub 3] and IrSb[sub 3]

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Container-title:AIP Conference Proceedings
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Author:

Caillat Thierry,Borshchevsky Alex,Fleurial Jean-Pierre,El-Genk Mohamed S.,Hoover Mark D.

Publisher

AIP

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials;Journal of Electronic Materials;2017-04-18

2. Concepts for medium-high to high temperature thermoelectric heat-to-electricity conversion: a review of selected materials and basic considerations of module design;Translational Materials Research;2015-06-30

3. The temperature dependence of thermal expansion for p-type Ce0.9Fe3.5Co0.5Sb12and n-type Co0.95Pd0.05Te0.05Sb3skutterudite thermoelectric materials;Philosophical Magazine;2012-04

4. Thermal expansion of skutterudites;Journal of Applied Physics;2010-02-15

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