Effect of deposition time of sputtering Ag-Cu thin film on mechanical and antimicrobial properties-Reference-Cited by-同舟云学术

Effect of deposition time of sputtering Ag-Cu thin film on mechanical and antimicrobial properties

Published:2018 Issue: Volume: Page:
ISSN:0094-243X
Container-title:AIP Conference Proceedings
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Author:

Purniawan A.,Hermastuti R.,Purwaningsih H.,Atmono T. M.

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Link

http://aip.scitation.org/doi/pdf/10.1063/1.5030230

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