Probing the electric and thermoelectric response of ferroelectric 2H and 3R α-In2Se3

Author:

Rahimi M.1ORCID,Sobnath K.1ORCID,Chen L.1ORCID,Mallet F.1ORCID,Lafarge P.1ORCID,Barraud C.1ORCID,Alekhin A.1ORCID,Brochard-Richard C.2ORCID,Bouaziz M.2ORCID,Chaste J.2ORCID,Ouerghi A.2ORCID,Della Rocca M. L.1ORCID

Affiliation:

1. Laboratoire Matériaux et Phénomènes Quantiques, Université Paris Cité, CNRS UMR 7162 1 , F-75013 Paris, France

2. Centre de Nanosciences et de Nanotechnologies, Université Paris-Saclay, CNRS UMR 9001 2 , 91120 Palaiseau, France

Abstract

Two-dimensional van der Waals ferroelectric materials play an important role in a wide spectrum of semiconductor technologies and device applications. Integration of ferroelectrics into 2D-layered material-based devices is expected to offer intriguing working principles and add desired functionalities for next-generation electronics. Here, we investigate the electric and thermoelectric properties of thin layers of the 2H and 3R polymorphs of α-In2Se3 embedded in solid-state three-terminal devices. Charge transport measurements reveal a hysteretic behavior that can be ascribed to the effect of ferroelectric polarization at the metal electrode/2D semiconductor interfaces. The thermoelectric investigation of the same devices unveils a well-defined negative signal of the order of 100–200 μV/K in absolute value for the 2H polymorph, showing a slight modulation as a function of the gate voltage. An analogous but noisy thermoelectric voltage is measured for devices based on the 3R polymorph, where indeed a constant finite transversal offset in the 100 μV-few mV range is detected, which does not depend on the applied temperature gradient. We argue that these experimental observations are related to a strong residual in-plane ferroelectric polarization in the 3R α-In2Se3 polymorph thin layer. Our results show that the thermoelectric response is a fine probe of the ferroelectric character of 2D layered α-In2Se3.

Funder

Agence Nationale de la Recherche

Publisher

AIP Publishing

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