Tomography of integrated circuit interconnect with an electromigration void-Reference-Cited by-同舟云学术

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Tomography of integrated circuit interconnect with an electromigration void

Published:2000-05 Issue:9 Volume:87 Page:4483-4488
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Levine Zachary H.,Kalukin Andrew R.,Kuhn Markus,Frigo Sean P.,McNulty Ian,Retsch Cornelia C.,Wang Yuxin,Arp Uwe,Lucatorto Thomas B.,Ravel Bruce D.,Tarrio Charles

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.373095

Reference12 articles.

1. Tomographic reconstruction of an integrated circuit interconnect

2. Ultrahigh-Resolution X-ray Tomography

3. Electron microscopic tomography: A tool for probing the structure and function of subcellular components

4. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

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