1. Raghbir Singh Khandpur, Printed Circuit Boards: Design, Fabrication, and Assembly (Mc Graw Hill Electronics Engineering, USA, 2006).
2. IPC-A-600, Revision H-2010, Acceptability of Printed Boards (IPC, USA, 2010).
3. IPC-SM-840D, Qualification and Performance of Permanent Solder Mask (IPC, USA, 2007).
4. Diagnose the Causes of Cost Deviation in Highway Construction Projects by Using Root Cause Analysis Techniques
5. Improve the extrusion process in tire production using Six Sigma methodology