Author:
Pakpum Chupong,Kanchiang Kanokwan
Reference6 articles.
1. G. H. Jeong, J. H. Kim, D. Lee, S. J.Suh, Mater. Res. Soc. Symp. Proc. 894, 1894-LL03-16.1-5 (2006).
2. T. Namazu, H. Takemoto, S. Inoue, Sensor Mater. 22(1), 13–24 (2010).
3. A new approach of creating Au-Sn solder bumps from electroplating
4. Au-Sn SLID Bonding—Properties and Possibilities
5. Mechanical Properties of Intermetallic Compounds in the Au–Sn System