Evolution of strain energy during recrystallization of plated Cu films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4807409
Reference19 articles.
1. A quantitative analysis of room temperature recrystallization kinetics in electroplated copper films using high resolution x-ray diffraction
2. Underlayer effects on texture evolution in copper films
3. Thermal strain in lead thin films I: Dependence of the strain on crystal orientation
4. Texture evolution during grain growth in polycrystalline films
5. Effects of barrier layer and annealing on abnormal grain growth in copper thin films
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1. Oxygen-mediated selection of Cu crystallographic orientation for growth of single-crystalline graphene;Applied Surface Science;2022-05
2. Effects of strain energy on the recrystallization within narrow metallization;Journal of Applied Physics;2018-01-28
3. Evolution of Strain Energy During Recrystallization of Plated Cu Films;IEEE Transactions on Device and Materials Reliability;2016-12
4. Prediction of recrystallization times in electroplated copper thin films;Thin Solid Films;2016-09
5. Rapid trench initiated recrystallization and stagnation in narrow Cu interconnect lines;Applied Physics Letters;2015-10-26
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