Effect of fabrication parameters on the ferroelectricity of hafnium zirconium oxide films: A statistical study

Author:

Salcedo Guillermo A.1ORCID,Islam Ahmad E.2ORCID,Reichley Elizabeth2ORCID,Dietz Michael3,Schubert-Kabban Christine M.4ORCID,Leedy Kevin D.2ORCID,Back Tyson C.5ORCID,Wang Weisong3ORCID,Green Andrew2ORCID,Wolfe Timothy1ORCID,Sattler James M.1ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, Air Force Institute of Technology 1 , Wright-Patterson AFB, Ohio 45433, USA

2. Air Force Research Laboratory, Sensors Directorate 2 , Wright-Patterson AFB, Ohio 45433, USA

3. Department of Electrical Engineering, Wright State University 3 , Dayton, Ohio 45435, USA

4. Department of Mathematics and Statistics, Air Force Institute of Technology 4 , Wright-Patterson AFB, Ohio 45433, USA

5. Air Force Research Laboratory, Materials and Manufacturing Directorate 5 , Wright-Patterson AFB, Ohio 45433, USA

Abstract

Ferroelectricity in hafnium zirconium oxide (Hf1−xZrxO2) and the factors that impact it have been a popular research topic since its discovery in 2011. Although the general trends are known, the interactions between fabrication parameters and their effect on the ferroelectricity of Hf1−xZrxO2 require further investigation. In this paper, we present a statistical study and a model that relates Zr concentration (x), film thickness (tf), and annealing temperature (Ta) with the remanent polarization (Pr) in tungsten (W)-capped Hf1−xZrxO2. This work involved the fabrication and characterization of 36 samples containing multiple sets of metal-ferroelectric-metal capacitors while varying x (0.26, 0.48, and 0.57), tf (10 and 19 nm), and Ta (300, 400, 500, and 600 °C). In addition to the well-understood effects of x and Ta on the ferroelectricity of Hf1−xZrxO2, the statistical analysis showed that thicker Hf1−xZrxO2 films or films with higher x require lower Ta to crystallize and demonstrated that there is no statistical difference between samples annealed to 500 and 600 °C, thus suggesting that most films fully crystallize with Ta ∼ 500 °C for 60 s. Our model explains 95% of the variability in the Pr data for the films fabricated, presents the estimates of the phase composition of the film, and provides a starting point for selecting fabrication parameters when a specific Pr is desired.

Funder

Air Force Office of Scientific Research

Air Force Research Laboratory

Publisher

AIP Publishing

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