Plastic deformation mechanisms of ultrafine-grained copper in the temperature range of 4.2–300 K-Reference-Cited by-同舟云学术

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Plastic deformation mechanisms of ultrafine-grained copper in the temperature range of 4.2–300 K

Published:2016-09 Issue:9 Volume:42 Page:825-835
ISSN:1063-777X
Container-title:Low Temperature Physics
language:en
Short-container-title:Low Temperature Physics

Author:

Isaev N. V.,Grigorova T. V.,Mendiuk O. V.,Davydenko O. A.,Polishchuk S. S.,Geidarov V. G.

Publisher

AIP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4964325

Reference48 articles.

1. Mechanical properties of nanocrystalline materials

2. Extreme grain refinement by severe plastic deformation: A wealth of challenging science

3. Grain-size dependence of the flow stress of Cu from millimeters to nanometers

4. Strength and tension/compression asymmetry in nanostructured and ultrafine-grain metals

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1. Low temperature tensile behavior and microstructure analysis of copper containing antibacterial stainless steel;Journal of Materials Research and Technology;2024-09

2. Low temperature plasticity of microcrystalline Al–Li alloy;Materials Science and Engineering: A;2023-02

3. Characterization of the hydroextruded oxygen-free copper via microindentation in the temperature range 77–300 K;Low Temperature Physics;2022-07

4. Experimental and numerical investigations of plastic strain mechanisms of AISI 316L alloys with bimodal grain size distribution;International Journal of Plasticity;2022-06

5. Friction-assisted pulse electrodeposition of high-performance ultrafine-grained Cu deposits;Surface Engineering;2021-09-08

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