Special topic on materials and devices for 5G electronics

Author:

Orloff Nathan D.1ORCID,Ubic Rick2ORCID,Lanagan Michael3ORCID

Affiliation:

1. National Institute of Standards and Technology, 325 Broadway Boulder, Colorado 80305, USA

2. Micron School of Materials Science and Engineering, Boise State University, 1910 University Drive, Boise, Idaho 83725, USA

3. Department of Engineering Science and Mechanics, Penn State University, N329 Millennium Science Complex, University Park, Pennsylvania 16802, USA

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Reference25 articles.

1. Federal Communications Commission, see https://www.fcc.gov/news-events/blog/2018/10/01/keeping-fast-pace-spectrum for “Keeping Up A Fast Pace On Spectrum (2018).”

2. See https://www.cisco.com/c/en/us/solutions/collateral/service-provider/visual-networking-index-vni/white-paper-c11-738429.html for “ Cisco Visual Networking Index: Global Mobile Data Traffic Forecast Update, 2017–2022 White Paper-Cisco.”

3. Federal Communications Commission, see https://www.fcc.gov/document/fcc-concludes-first-high-band-5g-airwaves-auctions for “FCC Concludes First High-Band 5G Airwaves Auctions (2019)”

4. What Will 5G Be?

5. Evaluation of linearity at 30 GHz for N-polar GaN deep recess transistors with 10.3 W/mm of output power and 47.4% PAE

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