Electroless Bismuth Plating as a Peripheral Technology for SiC Power Devices-Reference-Cited by-同舟云学术

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Electroless Bismuth Plating as a Peripheral Technology for SiC Power Devices

Published:2014 Issue:1 Volume:39 Page:47-51
ISSN:1382-3469
Container-title:Transactions of the Materials Research Society of Japan
language:en
Short-container-title:Trans. Mat. Res. Soc. Japan

Author:

Uchida Ei¹,Tanaka Kaoru¹,Okada Miri²,Tsuruoka Takaaki²,Akamatsu Kensuke²,Nawafune Hidemi²

Affiliation:

1. Ishihara Chemical Co., Ltd.

2. Frontiers of Innovative Research in Science and Technology (FIRST), Konan University

Publisher

The Materials Research Society of Japan

Link

https://www.jstage.jst.go.jp/article/tmrsj/39/1/39_47/_pdf

Reference11 articles.

1. [1] A. Senda, T. Nakagawa, Y. Takano, and T. Kasanami, Hyomen Gijutsu, 43, 324-9 (1992).

2. [2] A. Senda, T. Nakagawa, and Y. Takano, Hyomen Gijutsu, 43, 589-94 (1992).

3. [3] A. Senda, T. Nakagawa, and Y. Takano, Hyomen Gijutsu, 43, 694-9 (1992).

4. [4] A. Senda, T. Nakagawa, and Y. Takano, Hyomen Gijutsu, 43, 967-72 (1992).

5. [5] Y. Suzuoka, A. Ohki, T. Mizutani, and M. Ieda, J. Phys. D. Appl. Phys., 20, 511-7 (1987).

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3. Development of a nanoscale electroless plating procedure for bismuth and its application in template-assisted nanotube fabrication;RSC Advances;2021

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