Affiliation:
1. Metal Physics Lab., Physics Department, Faculty of Science, Mansoura University, Egypt
Abstract
Microstructure, thermal behavior, wettability and electrochemical corrosion parameters of Sn82Bi15Zn3, Sn77Bi15Zn3Sb5, Sn79Bi15Zn3Ag3 and Sn81.3Bi15Zn3Cu0.7 [Jagadeees1] alloys have been studied and analyzed. The contact angles of used alloys varied from 21° to 31° which is less than 90° (low contact angle). That is meant, wetting process of these alloys are very favorable and the fluid will spread over a large area of the surface. Melting temperature values of Sn82Bi15Zn3, Sn77Bi15Zn3Sb5, Sn79Bi15Zn3Ag3 and Sn81.3Bi15Zn3Cu0.7 [Jagadeees2] alloys are lower than tin based eutectic solder alloys, (Sn- Zn or Sn- Cu or Sn- Sb), by 11% to 22%. Scanning electron microscope, x-ray analysis and differential scanning calorimetry graphs show that, the used alloys contained different phases. Corrosion rate of Sn82Bi15Zn3 alloy in HCl varied after adding alloying elements. Sn77Bi15Zn3Sb5 alloy has lowest corrosion rate value.
Publisher
Oriental Scientific Publishing Company
Subject
Pharmacology (medical),Complementary and alternative medicine,Pharmaceutical Science
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