Non-contact removal of 60-nm latex particles from silicon wafers with laser-induced plasma
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference11 articles.
1. Potential thermo-mechanical substrate damage in nanoparticle removal with pulsed lasers
2. Nanoparticle removal from substrates with pulsed-laser induced plasma and shock waves
3. Removal of small particles on silicon wafer by laser-induced airborne plasma shock waves
4. Nanoparticle removal from trenches and pinholes with pulsed-laser induced plasma and shock waves
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