Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage-Reference-Cited by-同舟云学术

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Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage

Published:2002-01 Issue:8 Volume:16 Page:1027-1040
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Wang Zenglin,Furuya Akihiko,Yasuda Keiichirou,Ikeda Hideo,Baba Tomoyuki,Hagiwara Muneaki,Toki Sotaro,Shingubara Shoso,Kubota Hiroshi,Ohmi Tadahiro

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference18 articles.

1. Polyimide insulators for multilevel interconnections

2. Properties of Thin Polyimide Films

3. Adhesion enhancement of Cr/polyimide interfaces using RF pre-sputtering of polyimide surfaces

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