Metal deposition on liquid crystal polymers for molded interconnect devices using physical vapor deposition-Reference-Cited by-同舟云学术

Metal deposition on liquid crystal polymers for molded interconnect devices using physical vapor deposition

Published:2004-01 Issue:8 Volume:18 Page:883-891
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Wang B.,Eberhardt W.,Kück H.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference9 articles.

1. Feldman, K. 1996.Proceedings 2nd International Congress on Molded Interconnect Devices, MID 1996, 5–16. Bamberg: Meisenbach.

2. Yagi, Y., Harazono, F. and Ikegawa, N. 2002.Proceedings of the 5th International Congress on Molded Interconnect Devices, MID 2002, 99–107. Bamberg: Meisenbach.

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