Adhesion Enhancement of Electroplated Cu/Electroless Ni Composite Layer to (PMDA-ODA)-Type Polyimide Films-Reference-Cited by-同舟云学术

Adhesion Enhancement of Electroplated Cu/Electroless Ni Composite Layer to (PMDA-ODA)-Type Polyimide Films

Published:2008-01-01 Issue:1 Volume:22 Page:47-64
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Lee Hong-Kee¹,Son Seong-Ho²,Lee Ho-Young³,Koo Seok-Bon⁴

Affiliation:

1. a Nano-Surface Technology Team, Division of Production Technology, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, South Korea

2. b Nano-Surface Technology Team, Division of Production Technology, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, South Korea

3. c Nano-Surface Technology Team, Division of Production Technology, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, South Korea

4. d Nano-Surface Technology Team, Division of Production Technology, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, South Korea

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1163/156856108X292269

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