Adhesion of copper to poly(tetrafluoroethylene) surfaces modified with vacuum UV radiation from helium arc plasma-Reference-Cited by-同舟云学术

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Adhesion of copper to poly(tetrafluoroethylene) surfaces modified with vacuum UV radiation from helium arc plasma

Published:2003-01 Issue:13 Volume:17 Page:1801-1813
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Zheng S.,Entenberg A.,Takacs G. A.,Egitto F. D.,Matienzo L. J.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference67 articles.

1. Plasma modification of polymer surfaces for adhesion improvement

2. Chemical and physical modification of fluoropolymer surfaces for adhesion enhancement: a review

3. Investigation of wet chemical-treated poly(tetrafluoroethylene) surface and its metallization with SIMS, XPS and atomic force microscopy

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Vacuum UV Surface Photo‐Oxidation of Polymeric and Other Materials for Improving Adhesion: A Critical Review;Progress in Adhesion and Adhesives;2021-08-20

2. Vacuum UV Surface Photo-Oxidation of Polymeric and Other Materials for Improving Adhesion: A Critical Review;REV ADHES ADHES;2020

3. Recent progress on non-thermal plasma technology for high barrier layer fabrication;Plasma Science and Technology;2018-02

4. Fluoride ions at the Cu-fluoropolymer interface;Surface and Interface Analysis;2013-03-15

5. Surface modification of poly(tetrafluoroethylene-co-hexafluoropropylene) with vacuum UV radiation from rotating helium dc arc plasmas;Journal of Adhesion Science and Technology;2007-01

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