Thermal imidization of poly(amic acid) on Si(100) surface modified by plasma polymerization of glycidyl methacrylate-Reference-Cited by-同舟云学术

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Thermal imidization of poly(amic acid) on Si(100) surface modified by plasma polymerization of glycidyl methacrylate

Published:2000-01 Issue:13 Volume:14 Page:1723-1744
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Zhang Yan,Tan K. L.,Yang G. H.,Zou X. P.,Kang E. T.,Neoh K. G.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference39 articles.

1. Lee, Y. K. and Craig, J. D. 1982.Polymer Materials for Electronic Applications, Edited by: Feit, E. D. and Wilkins, C. W. J. 105Washington, DC: American Chemical Society.

2. Effects of coupling agent thickness on residual stress in polyimide/γ-APS/silicon wafer j oints

3. Controlling factors in chemical coupling of polymers to metals

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1. Postradiation polymerization of tetrafluoroethylene on mineral supports at low temperatures;High Energy Chemistry;2008-11

2. Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Plasma Graft Copolymerization and UV-induced Graft Copolymerization with 4-Vinylpyridine;Macromolecular Materials and Engineering;2003-02

3. Polymer surface with graft chains;Progress in Polymer Science;2003-02

4. Surface modification of polyimide films via plasma polymerization and deposition of allylpentafluorobenzene;Polymer;2002-12

5. Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine;Applied Surface Science;2002-10

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