Anisotropic Conductive Adhesives for Flip-Chip Interconnects
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference24 articles.
1. Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density
2. Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film
3. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure
4. Farley, D., Dasgupta, A. and Caers, J. 2005.Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems471–477. EuroSimE 2005
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