Author:
Hsiung J.-C.,Pearson R. A.,Lloyd T. B.
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Reference18 articles.
1. An experimental study of die attach polymer bleedout in ceramic packages
2. Nguyen, M. N., Chien, I. Y., Gross, M. B., Chau, M. M. and Burkhart, D. A.Proc. of 45th Electronic Components and Technol. Conf, 6821995).
Cited by
2 articles.
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