Study of Interfacial Moisture Diffusion at Epoxy/Cu Interface
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference26 articles.
1. Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints
2. Microstructure, adhesion strength and failure path at a polymer/roughened metal interface
3. Contributions of the nanovoid structure to the kinetics of moisture transport in epoxy resins
4. A discussion of the molecular mechanisms of moisture transport in epoxy resins
5. Moisture diffusion in epoxy systems
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3. Hygrothermal behaviour of the polyester/glass fiber composite;Journal of Adhesion Science and Technology;2022-03-27
4. Effects of moisture exposure on the crosslinked epoxy system: an atomistic study;Modelling and Simulation in Materials Science and Engineering;2016-03-01
5. Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness;International Journal of Fracture;2013-11-21
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