Nanoindentation Experimental Approach and Numerical Simulation of Al/Cr Bilayer Films-Reference-Cited by-同舟云学术

Nanoindentation Experimental Approach and Numerical Simulation of Al/Cr Bilayer Films

Published:2011-01 Issue:7 Volume:18 Page:615-626
ISSN:0927-6440
Container-title:Composite Interfaces
language:en
Short-container-title:Composite Interfaces

Author:

Zhang Liqiang¹,Yang Ping²,Shang Shuaihua³,Li Chunquan⁴,Song Xifu⁵

Affiliation:

1. a Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, P. R. China

2. b Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, P. R. China

3. c Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, P. R. China

4. d Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, P. R. China

5. e Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, P. R. China

Publisher

Informa UK Limited

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Ceramics and Composites

Link

https://www.tandfonline.com/doi/pdf/10.1163/156855411X615769

Reference13 articles.

1. High-temperature interface superconductivity between metallic and insulating copper oxides

2. An overview of some key issues about micro/nano manufacturing

3. Interface adhesion: effects of plasticity and segregation

4. Research on characteristics of interfacial heat transport between two kinds of materials using a mixed MD–FE model

5. Measurement of Young’s modulus and Poisson’s ratio for thin Au films using a visual image tracing system

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2. Mechanical characteristics comparison approach on metal – matching nano-interface based on Cr in electronic packaging;Composite Interfaces;2013-04-22

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