Author:
Yun H.K.,Cho K.,An J.H.,Park C.E.,Sim S.M.,Park J.M.
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Reference15 articles.
1. Wachsman, E. D., Martin, P. S. and Frank, C. W. 1989.Polymeric Materials for Electronic Packaging and Interconnection, ACS Symposium Series, No. 407 Edited by: Lupinski, J. H. and Moore, R. S. 26–48. Washington, DC: American Chemical Society.
2. Mechanism of electromigration in ceramic packages induced by chip-coating polyimide
3. Satou, H., Suzuki, H. and Makino, D. 1990.Polyimides, Edited by: Wilson, D., Stenzenberger, H. D. and Her- genrother, P. M. 227–251. Glasgow: Blackie.
4. Arnold, C. A., Summers, J. D., Chen, Y. P., Yoon, T. H., McGrath, B. E., Chen, D. and McGrath, J. E. 1989.Polyimides: Materials, Chemistry and Characterization, Edited by: Feger, C., Khojasteh, M. M. and McGrath, J. E. 69–89. New York: Elsevier.
5. Manzione, L. T. 1990.Plastic Packaging of Microelectronic Devices, 292–336. New York: Van Nostrand Reinhold.
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