Past experiences in the development of tests for adhesive bond strength-Reference-Cited by-同舟云学术

Past experiences in the development of tests for adhesive bond strength

Published:1991-01 Issue:8 Volume:5 Page:583-599
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Thompson R.B.,Thompson D.O.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference32 articles.

1. Shelton, W. L. 1975.Proceedings of the ARPA/AFML Review of Quantitative NDE, 537Dayton, OH: Air Force Materials Laboratory. Report AFML-TR-75-212

2. Tupper, N. 529 in ref. 1

3. Workshop on NDE of Adhesive Bond Strength. San Antonio, TX: Non- destructive Testing Information Analysis Center.

4. Williams, F. S. 1973.Interdisciplinary Workshop on Nondestructive Testing-Materials Characterization, 453CA: North American Rockwell Science Center, Thousand Oaks.

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