Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference17 articles.
1. Interfacial reaction during metallization of cured polyimide: An XPS study
2. An XPS and TEM Study of Intrinsic Adhesion Between Polyimide and Cr Films
3. X‐ray photoelectron and infrared spectroscopy of microwave plasma etched polyimide surfaces
4. Complex formation and growth at the Cr– and Cu–polyimide interface
5. Adhesion and interface investigation of polyimide on metals
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