Anisotropic alignment of nickel particles in a magnetic field for electronically conductive adhesives applications
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference20 articles.
1. Reliability assessment of isotropically conductive adhesive joints in surface mount applications
2. Electrically conductive adhesives: a prospective alternative for SMD soldering?
3. Conductive adhesives for SMT and potential applications
4. Development of conductive adhesive joining for surface-mounting electronics manufacturing
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