1. 1) K. Abe, K. Susai: The Gradation Phenomenon of the Aluminum Wire Crimp Terminal in the Thermal Shock Test, Furukawa Electric Review, 129 (2012), 5-10. (in Japanese)
2. 2) R. Kawanishi, K. Ouchi: Study of Galvanic Corrosion of Various Metals, Hitachi Review, 45-5 (1963), 72-75. (in Japanese)
3. 3) K. Sakurada, Y. Yanagihara, M. Nakai and T. Nagashima: Development of Cu/Al Clad Material for Downsizing EV Battery, NISSAN TECHNICAL REVIEW, 85（2019), 24-29. (in Japanese)
4. 4) W. Xie, T. Yamaguchi, K. Nishio: Formation of Intermetallic Phases on the Bond Interface of Aluminum-Clad Copper, Journal of the Japan Institute of Metals, 75-3 (2011), 166-172, https://doi.org/10.2320/jinstmet.75.166. (in Japanese)
5. 5) 安部 栄一, 藤沢 正尚: 電子ビーム溶接による銅とアルミニウムの接合について, 溶接学会全国大会講演概要, 13 (1973), 192-193. (in Japanese)