Modeling and Questionnaire Survey for Effective Regulated Egress Based on Level of Discomfort

Author:

Miyagawa Riku1,Yanagisawa Daichi12ORCID,Jia Xiaolu1ORCID,Shoji Yasushi3ORCID,Aikoh Tetsuya3ORCID,Nishinari Katsuhiro124ORCID

Affiliation:

1. Department of Aeronautics and Astronautics, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan

2. Mobility Innovation Collaborative Research Organization, The University of Tokyo, Kashiwa, Japan

3. Research Faculty of Agriculture, Hokkaido University, Sapporo, Japan

4. Research Center for Advanced Science and Technology, The University of Tokyo, Tokyo, Japan

Abstract

Regulated egress is often conducted after large events to avoid extreme congestion at stations around event venues. In regulated egress, people are divided into several groups and egress in order. By controlling the number of groups and the time interval between each group’s egress, managers can mitigate the congestion at the stations. In this study, a mathematical model was developed to identify the effective regulated egress. level of discomfort (LOD) was used to evaluate the performance of the regulated egress instead of the total egress time. LOD is the product of the function of density and duration of egress and represents the accumulated discomfort through the egress. A questionnaire survey was conducted to determine the LOD function parameters. Under the assumed conditions, the results of the calibrated model indicated that effective regulated egress could be conducted by dividing the people into two or three groups, which is presumable in terms of management in the real world. In addition to the main result for the effective number of groups, the robustness of the model was confirmed by comparing the results of the two types of LOD functions. In other words, the effective number of groups does not strongly depend on the detailed form of the LOD functions.

Funder

Japan Science and Technology Agency

Japan Society for the Promotion of Science

Publisher

Fuji Technology Press Ltd.

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