Author:
Yasui Manabu, ,Kaneko Satoru,Takahashi Masaharu,Sano Takashi,Hirabayashi Yasuo,Ozawa Takeshi,Maeda Ryutaro, ,
Abstract
We demonstrate the heat-resistant property of a Ni-W electroformed mold (Ni-W mold) used as the micro imprinting die for an Al alloy. To enhance the transfer performance of the Ni-W mold to A2017, we carried out micro imprinting for A2017 at 600°C. However, entire Ni-W patterns stuck to A2017. It is considered that Al, a major component of A2017, and Ni, a major component of a Ni-W mold, formed an intermetallic compound at 600°C.
Publisher
Fuji Technology Press Ltd.
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
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