Abstract
In this paper, a vacuum chamber is designed to facilitate the hot pressing bonding of microfluidic chips, according to the current microfluidic chip hot pressing bonding process, chip deformation, flow channel edge bubbles and other problems, Hot-pressed bonding in a vacuum device is proposed to hot-press the chip, combined with the structure of the heat press, the structure of the vacuum box, the connection line, etc. were designed, use solidworks3D modeling, the design, production, assembly and experiment of the vacuum hot pressing device were completed.
Publisher
Darcy & Roy Press Co. Ltd.
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