Temperature rise simulation and thermal strain study of ring main unit

Abstract

The internal structure of the Ring Main Unit is compact, the gap between the components is limited, and the heat dissipation performance is poor. Working in a high temperature environment for a long time will lead to structural deformation and aging, which will affect the service life and insulation performance, and may even lead to electrical accidents. In order to better solve such problems, this study uses the finite element multi-physics coupling simulation model. According to the characteristics of the Ring Main Unit, the internal components and the body are simplified, the calculation amount is reduced and the simulation accuracy is improved. In ANSYS Workbench, through the coupling calculation of steady-state heat and transient heat, the temperature distribution of the Ring Main Unit circuit under the condition of external temperature is obtained. The temperature change and distribution are further used for the thermal stress and strain analysis of the structural field to obtain the thermal strain distribution map of the conductive circuit under the influence of temperature, which provides theoretical support for the internal structure design of the new Ring Main Unit.