Modeling Of 3D Integrated Circuits, Heat Transfer Solutions and Application

Abstract

As transistor sizes approach the quantum limit, the cost of further shrinking them becomes prohibitively high. To overcome this limitation and surpass Moore's Law, 3D (Integrated Circuits) IC technology has emerged. However, while 3D ICs offer advantages like high integration, they also present challenges related to thermal management. This paper introduces and discusses partial differential equations and modeling methods for heat transfer in 3D ICs. It explores solutions to address thermal conduction problems and analyzes the potential application areas and prospects of 3D ICs. By utilizing different modeling methods, we can optimize the heat transfer problem during the design stage. To enhance the thermal conduction of 3D ICs, this study proposes the use of copper thermal conductive materials, graphene thermal conductive layers, and phase-change material cooling. As technology advances and costs decrease, 3D ICs are expected to find broader applications in high-performance computing, artificial intelligence, the Internet of Things, and other fields. Despite its numerous advantages, 3D integrated circuit technology still faces challenges such as cost, heat, and silicon vias. To address these issues, further technological innovations and updates to Computer Aided Design (CAD) tools are necessary. Overall, this study holds significant social and scientific importance as it promotes the development of 3D IC technology, improves electronic device performance, and advances scientific research.