Effect of Heat Transfer Performance and Thermodynamic Analysis of Complex Structured Double-layer Microchannels Heat Sink

Abstract

As microelectronics become more and more integrated, in order to solve the increasingly serious microelectronic heat dissipation problem. Design of a complex structure with a double layer channel. The upper layer is a rectangular channel and the lower layer is a complex structure of the design. The DLCF (double layer counter flow) and SLCF (single layer counter flow) are compared numerically. The innovative design suggested in this paper is contrasted with the upper and lower layers, which are both rectangular channels. The simulation is carried out using FLUENT software. Based on previous studies, the concept of enhanced heat transfer coefficient was used to predict the heat transfer efficiency of channels. The friction factor, Reynolds number, as well as the temperature and thermal resistance along the channel are derived. From the results, it is clear that the complex structure of the double-layered channel designed in this paper has a higher heat transfer efficiency. The enhanced heat transfer factor number is higher.