Author:
Kim Kwang-Seok,Kim Yongil,Jung Seung-Boo
Abstract
Abstract
The microstructural evolution and the adhesion of an Ag nanopaste screen-printed on a silicon substrate were investigated as a function of sintering temperature. Through the two thermal analysis methods, such as differential scanning calorimeter and thermo-gravimetric analysis, the sintering conditions were defined where the temperature was raised from 150°C to 300°C, all with a fixed sintering time of 30 min. The microstructure and the volume of the printed Ag nanopaste were observed using a field emission scanning electron microscope and a 3-D surface profiler, respectively. The apparent density of the printed Ag nanopaste was calculated depending on the sintering conditions, and the adhesion was evaluated by a scratch test. As the sintering temperature increased from 150°C to 300°C, the apparent density and the adhesion increased by 22.7% and 43%, respectively. It is confirmed that the printed Ag nanopaste sintered at higher temperatures showed higher apparent density in the microstructural evolution and void aggregation, resulting in the lower electrical resistivity and various scratched fractures.
Publisher
Springer Science and Business Media LLC
Subject
Condensed Matter Physics,General Materials Science
Cited by
62 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献