Unique characteristics of residual stress distribution of large-diameter keyaki (Zelkova serrata) logs and examination of their measurement method

Author:

Kameyama Naohisa,Matsuo-Ueda MiyukiORCID,Chen ShuoyeORCID,Jiang ZhuotingORCID,Ichiyanagi Tatsuya,Yoshida MasatoORCID,Yamamoto HiroyukiORCID

Abstract

AbstractLarge-diameter keyaki (Zelkova serrata Makino) logs have long been used in Japan as high-quality material especially for traditional construction and furniture. However, unlike other major wood species in Japan, keyaki has been practically considered as a wood species of high difficulty when processing. Keyaki frequently shows processing defects due to sawing, such as warping, cracking, and so forth, which often reduces the production yield of logs. Furthermore, there are drastic differences in those behaviors between individual logs, so causing unexpected processing defects. A scientific approach is required to improve this situation, but data on the material characteristics of keyaki were scarce. This study aimed to characterize the radial pattern of the residual stress as one of the processing-related characteristics. The measurement method was also examined. This study used diametral planks obtained from large-diameter keyaki logs to measure released strain of residual stress from pith to the bark sides. The results showed the distribution of released strain often showed peculiar zig-zag patterns characterized with localized residual stress, unlike the smooth bell curve pattern seen in typical logs of other species. Because of the unique characteristics, some practical points related to the measuring methodology were investigated. The extent of influence of this residual stress in the longitudinal direction was limited to within 30 cm from the site of measurement of the strain. In addition, the length of log necessary to measure the released strain without being affected by crosscutting was more than four times the log diameter—greater than the diameter ratio theorized by previous studies.

Publisher

Springer Science and Business Media LLC

Subject

Biomaterials

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