Genomics and data science: an application within an umbrella
Author:
Funder
NSF
Publisher
Springer Science and Business Media LLC
Link
http://link.springer.com/content/pdf/10.1186/s13059-019-1724-1.pdf
Reference92 articles.
1. Davenport TH, Patil DJ. Data scientist: the sexiest job of the 21st century. Harv Bus Rev. 2012;90:70–6.
2. Provost F, Fawcett T. Data science and its relationship to big data and data-driven decision making. Big Data. 2013;1:51–9.
3. Tukey JW. The future of data analysis. Ann Math Stat. 1962;33:1–67.
4. Tansley S, Tolle KM. The fourth paradigm: Microsoft Press; 2009.
5. Jordan MI, Mitchell TM. Machine learning: trends, perspectives, and prospects. Science. 2015;349:255–60.
Cited by 48 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. SCI-VCF: a cross-platform GUI solution to summarize, compare, inspect and visualize the variant call format;NAR Genomics and Bioinformatics;2024-07-02
2. Identification and characterization of abiotic stress-tolerant genes in rice (Oryza sativa L.): a computational approach;Journal of Plant Diseases and Protection;2024-03-28
3. Considering the Clinical Significance of Artificial Intelligence and Biosensors in the Healthcare Sector: A Review;2024 IEEE International Students' Conference on Electrical, Electronics and Computer Science (SCEECS);2024-02-24
4. Applications of Machine Learning (ML) and Mathematical Modeling (MM) in Healthcare with Special Focus on Cancer Prognosis and Anticancer Therapy: Current Status and Challenges;Pharmaceutics;2024-02-09
5. SCI-VCF: A cross-platform application to summarise, compare and design interactive visualisations of the variant call format;2023-08-13
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3